Direct approach can bond and debond 2D semiconductors without any glue-like materials

Direct approach can bond and debond 2D semiconductors without any glue-like materials










A key objective of electronics engineers is to further reduce the size of devices, while also boosting their speed, performance and efficiency. Two-dimensional (2D) semiconductors, single-layer and thin materials with a controllable electrical conductivity, have been found to be particularly promising for the development of smaller electronics.










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