{"id":8576,"date":"2025-11-23T04:02:30","date_gmt":"2025-11-23T04:02:30","guid":{"rendered":"https:\/\/mailitics.com\/index.php\/2025\/11\/23\/direct-approach-can-bond-and-debond-2d-semiconductors-without-any-glue-like-materials\/"},"modified":"2025-11-23T04:02:30","modified_gmt":"2025-11-23T04:02:30","slug":"direct-approach-can-bond-and-debond-2d-semiconductors-without-any-glue-like-materials","status":"publish","type":"post","link":"https:\/\/mailitics.com\/index.php\/2025\/11\/23\/direct-approach-can-bond-and-debond-2d-semiconductors-without-any-glue-like-materials\/","title":{"rendered":"Direct approach can bond and debond 2D semiconductors without any glue-like materials"},"content":{"rendered":"<p>    Direct approach can bond and debond 2D semiconductors without any glue-like materials<br \/>\n \t<BR><br \/>\n<BR><\/BR><br \/>\n    <!-- no image --><br \/>\n \t<BR><br \/>\n<BR><\/BR><\/p>\n<div>A key objective of electronics engineers is to further reduce the size of devices, while also boosting their speed, performance and efficiency. Two-dimensional (2D) semiconductors, single-layer and thin materials with a controllable electrical conductivity, have been found to be particularly promising for the development of smaller electronics.<\/div>\n<p> \t<BR><br \/>\n <BR><\/BR><\/p>\n<p> \t<BR><br \/>\n<BR><\/BR><br \/>\n<a href=\"https:\/\/techxplore.com\/news\/2025-11-approach-bond-debond-2d-semiconductors.html\">Go to techxplore<\/a><br \/>\n \t<BR><br \/>\n <BR><\/BR><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Direct approach can bond and debond 2D semiconductors without any glue-like materials A key objective of electronics engineers is to further reduce the size of devices, while also boosting their speed, performance and efficiency. Two-dimensional (2D) semiconductors, single-layer and thin materials with a controllable electrical conductivity, have been found to be particularly promising for the [&hellip;]<\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[49,45],"tags":[50],"class_list":["post-8576","post","type-post","status-publish","format-standard","hentry","category-engineering","category-techxplore","tag-techxplore"],"_links":{"self":[{"href":"https:\/\/mailitics.com\/index.php\/wp-json\/wp\/v2\/posts\/8576"}],"collection":[{"href":"https:\/\/mailitics.com\/index.php\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/mailitics.com\/index.php\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/mailitics.com\/index.php\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/mailitics.com\/index.php\/wp-json\/wp\/v2\/comments?post=8576"}],"version-history":[{"count":0,"href":"https:\/\/mailitics.com\/index.php\/wp-json\/wp\/v2\/posts\/8576\/revisions"}],"wp:attachment":[{"href":"https:\/\/mailitics.com\/index.php\/wp-json\/wp\/v2\/media?parent=8576"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/mailitics.com\/index.php\/wp-json\/wp\/v2\/categories?post=8576"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/mailitics.com\/index.php\/wp-json\/wp\/v2\/tags?post=8576"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}